液態(tài)墊板鉆孔應(yīng)用研究

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Research on the Application ofDrilling with Liquid Deburr Film

WEIMeixiao LIU Yi LI Jingtao YIN Dawei ZHANG Lunqiang HUANG Yunzhong

（Shenzhen Newccess Industrial Co.，Ltd.）

Abstract：Withtherapiddevelopmentof theEthernet，bigdata，smart phones，andartificial inteligence，higher requirements are put forward for PCB. The high multi-layer PCB （board thickness i≥3.5mm ）may have PCB warping， poor surfaceflatness，height diferences，and other issues due to designand manufacturing processes.The rigid-flex board （R-FPCB）combines flexible circuit boardsand rigid circuit boards.In a combined structure，there must be differences in thickness，which lead toaheight diference in its surface structure.Both high multi-layerPCBs （witha thicknes AA≥3.5mm and rigid-flex boards （R-FPCBs） have burrs during mechanical driling，caused by surface warping，poor surface fatness and height diferences ofthe boards，which hasnot beensolved.This paperanalyzes thereasons for burrs dueto warping and height differences during mechanical drillingon PCB，and expoundson some common methodsand drawbacks for improving burrs inthe PCB industryat present.Itproposes an innovative technology that effectively improves mechanical driling burrsonPCBcausedbywarpingandheightdiferences，and introduces theresearch，applicationandevaluationof

the new technology in detail.

Keywords：highmulti-storey; thick plate;rigid-flex printedcircuitboard（R-FPCB）;bur;warping;height diference;base plate

0 引言

隨著電子設(shè)備向高密度、高功率、小型化及柔性化方向迅猛發(fā)展，高多層厚板和剛撓結(jié)合板憑借其優(yōu)異的電氣性能、結(jié)構(gòu)強(qiáng)度及三維互連能力，在高端通信設(shè)備、服務(wù)器、汽車電子、航空航天以及可穿戴設(shè)備等領(lǐng)域獲得了廣泛應(yīng)用。（剩余3568字）