小尺寸陶瓷封裝用熔覆金錫合金焊料蓋板可靠性驗證
打開文本圖片集
Reliability Verification of Cladding Gold-tin Alloy Solder Cover for Small-sized Ceramic Packagee
WANG Mingyang PENG Bo WEI Yujin SONG Yunhe （The 13th Research Institute of China Electronics Technology Group Corporation
Abstract：Thepaperisbasedontheindependentlydevelopedcladdinggold-tinaloysoldercover，andanalyzesthereliability ofthecoverfromtheaspectsof theprocessing state，thegold totinratioofsolderforcladding，andtheoxidationdegreeof solderaftercladding.Thereliabilitytestsareconductedbysimulating theactualuse environmentofthe products.Meanwhile， it analyzes the microstructure of the cladding interface and the coating structure by scanning electron microscopy.
Keywords： cladding gold-tin alloy solder cover; reliability; microstructure
0 引言
微電子封裝中陶瓷外殼因其高可靠性的優(yōu)點被廣泛應(yīng)用在各特殊領(lǐng)域，其未來發(fā)展趨勢呈現(xiàn)在單芯片高性能化封裝和多芯片高集成化封裝兩方面，由此導(dǎo)致了封裝外殼的逐步小型化。（剩余3496字）