晶圓級再布線過程控制質(zhì)量評價方法研究

打開文本圖片集

Research on Quality Evaluation Methods for Process Control of Wafer-levelRedistribution

TANG Shuo1 Ql Xiao1 LIU Haowen1 CHEN Wenhao2 SUN Xiaodong2 （1.China Electronics Standardization Institute; 2.The 58th Research Institute of China Electronics Technology Group Corporation）

Abstract： As a new packaging technology， wafer level ReDistribution Layer （RDL） package technology has the advantages suchas shortening interconnection，reducing powerconsumption，andimproving integration.Itisthecore technologyofthe currentmicrosystemsandmulti-chipcomponents procesing，andcanbeusedtorealizetheintegrationofnewmultifunctional devices and microsystems.This paper studies the manufacturing process ofRDL，and analyzes the processmonitoring and qualityevaluationmethodsofRDLprocess，aswellas themaindefectsandtypcalfilure modesofRDLproces，inoderto layafoundation forthe enrichmentand perfectionof integrated circuits.

Keywords：redistribution layer;process control; reliability

0 引言

（WLP）的基礎(chǔ)，是將芯片上的引腳通過薄膜工藝的再布線變換成陣列分布焊區(qū)或其他需要的分布圖形的焊區(qū)，最終形成凸點或鍵合引腳的一種封圓級再布線（RDL）是實現(xiàn)晶圓級封裝裝技術(shù)。（剩余4130字）