固體繼電器采用銅絲鍵合的可行性與評(píng)價(jià)研究
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Research on the Feasibility and Evaluation of Copper Wire Bonding in Solid Relays
WANG Jue ZHANG Qiu (China Electronics Standardization Institute)
Abstract:With the increasing maturityofcopper wire bonding technology,more and more civilian semiconductordevices arebonded with copper wire.Someequipment manufacturers have to choose copper wire bonding devices,but copper wire bonding devices are prone toreliabilityisues due to materialsand processes.This paper analyzes the feasibilityof copper wirebonding forsolidrelays.Basedontheresearchonforeignevaluationstandards forcopper wirebondingquality,thepaper discusses the evaluation of copper wire bonding in solid relays.
Keywords:copperwire;bonding; feasibility;evaluation
0 引言
固體繼電器從20世紀(jì)70年代發(fā)展至今，由最初簡單的分立結(jié)構(gòu)已經(jīng)發(fā)展到采用混合集成結(jié)構(gòu)的固體繼電器，混合集成結(jié)構(gòu)固體繼電器結(jié)合了傳統(tǒng)機(jī)械繼電器和固體繼電器的特點(diǎn)，具有小體積、高可靠性、長壽命、高靈敏度、低控制功率等特點(diǎn)。（剩余7222字）