電子元器件破壞性物理分析方法國內(nèi)外發(fā)展趨勢

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Domestic and International Development Trends of Destructive Physical Analysis (DPA) Methods for Electronic Components

WANG Shuang ZHOU Qinyuan (China Electronics Standardization Institute)

Abstract:With thesignificantadvances inmanufacturing technology,therapid increaseinmarketdemand,and the application of new materialsand processs,electroniccomponents are developing towards diversification,integrationand systematization.This paper aims to summarize the evolutionofDestructive Physical Analysis (DPA)methods for electronic components based on the research on revision of standards for DPA methods at home and abroad.

Keywords:DestructivePhysical Analysis; electronic components; development trends

0 引言

量與可靠性水平,確保其使用中的可靠性[

在元器件質(zhì)量檢測和可靠性評(píng)價(jià)的研究中，破壞性物理分析是一種常用的技術(shù)手段，對(duì)于提升產(chǎn)品可靠性水平具有其他試驗(yàn)和檢驗(yàn)手段無法替代的作用。（剩余6000字）