電子封裝納米材料及其性能研究進(jìn)展
打開文本圖片集
Research Progress of the Electronic Packaging Nanomaterial and its Performance
ZHENG Xiaofan ZHANG Yaojun YANG Zhentao SHAO Wenlong (The 13th Research Institute of China Electronics Technology Group Corporation)
Abstract: Packaging technology is the basis ofcomponents,and the performance of materials is thekey factordetermining the technical indicators of packaging.Nanomaterials are playing more and more important role in the field of electronic packaging.The superior electrical, magnetic and optical properties of nanomaterials can enhance and improve the performanceofpackaging.This paper introduces the aplication statusof threenanomaterialsas theinterconnectmaterials andthermal interface materials,whicharethesilver nanoparticles,coppernanoparticlesandcarbon-nanotube-reinforced solders.Finally,itoulines theprospectsoflarge-scale applicationofnanomaterialsin the fieldofelectronic packaging. Keywords: electronic packaging; silver nanoparticles; copper nanoparticles; carbon nanotube
0 引言
封裝是指承載半導(dǎo)體芯片、各種元件以及兩者集成的模塊、組件的包封體，其基本功能是提供電（光）信號互連、機(jī)械支撐、環(huán)境保護(hù)以及散熱等。（剩余7888字）