宇航元器件封裝材料進(jìn)展及發(fā)展趨勢(shì)
打開文本圖片集
Progress and Development Trend of Packaging Materials for Aerospace Devices and Components
MA Jiaji ZHANG Yaojun QIAO Zhizhuang SHAO Wenlong (The 13th Research Institute of China Electronics Technology Group Corporation)
Abstract:Aerospace devicesandcomponentsare thefoundationofaerospace projects.Packaging technologyis the basis of devicesand components.Astronautical devices requireoptimization of various performance indicators such as light weight andhigh strengthTherefore,thepackagingmaterialsshouldhaveexcelentmechanical,electricalandtermalproperties. This paper introduces thestructureoftypical packagesandthe progress inresearch anddevelopmentofceramicmaterials, conductormaterials,metalmaterialsandheatdisipate materials.Itfurtherpredictsthedevelopingtrendofpackagematerials based on relevant materialsat home and abroad.
Keywords: aerospace; packaging; material; developing trend
0 引言
宇航用高可靠電子元器件作為我國(guó)航天工程的重要基石，可以體現(xiàn)國(guó)家科技進(jìn)步，彰顯國(guó)家綜合科技實(shí)力。（剩余6808字）