陶瓷封裝BGA傳輸結(jié)構(gòu)的信號完整性研究

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Study on Signal Integrity of BGA Transmission Structure of Ceramic Package

YAN Junhao SHAO Wenlong YU Ximeng YANG Zhentao DUAN Qiang LIU Linjie (The13th Research Institute ofChina Electronics Technology Group Corporation)

Abstract:According tothepackagingrequirementsofhigh-frequencyandhigh-speedintegratedcircuits,aBGAdifferential signal transmisionstructurebasedonlow-temperatureco-firedceramic (LCC)technologyisproposed,withanalation frequencyrangeofDC\~40GHz.Theoveralltransmision structure includes anuppersubstrate,alowersubstrate,andsolder ballsmade ofceramic materials.The overal transmission performanceof theBGA diferentialsignal transmissionstructure Wasanalyzed through simulationsoftware.This paper evaluates the performance of transmision structures fromtwo aspects: timedomainandfrequencydomain.Inthetime domain,thesignal integrityofthe transmisionstructure ischaracterized by thescattering parameters tested byavector network analyzerand the eye diagram displayedbyanoscilloscope.Itfocuses on analyzing the impact of transmision loss and crosstalk onthe signal eye diagram of thestructure.In the frequencydomain, the scatering parameters testedbyavectornetwork analyzer areused tocharacterizethequalityofthechanel tansmission signal,andthetestingandsimulationhavegoodconsistencywithintheconsiderationoferorrange.Theresultsoffrequency domaintestsshow thatfromDC to 40GHz ,the return loss of the differential transmission structure isbetter than 15dB,and the insertion lossis better than O.5 dB.

Keywords:BGA transmission structure; signal integrity; eye diagram; ceramic package

0 引言

隨著5G信息技術(shù)的快速發(fā)展，高頻、高速的數(shù)字電路頻譜趨向于微波毫米波頻率范圍，可達幾十 GHz 。（剩余6345字）