陶瓷封裝熱管理技術(shù)發(fā)展與標(biāo)準(zhǔn)現(xiàn)狀分析
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Analysis of the Development and Standards Status of Thermal Management Technology for Ceramic Packaging
PENG Bo FAN Shichao LI Lixia （The 13th Research Institute of China Electronics Technology Group Corporation）
Abstract：Therapiddevelopmentofchiptechnologyhasbroughtunprecedentedchallenges toits thermalmanagement. Electronic packaging heat disspation isoneof the key measures to solve the thermalmanagement problem of chips.This paper systematicalyanalyzes the developmentof thermal management technology forsingle-chippackaging and multi-chip packaging，andconducts statisticalanalysis ontherelevantstandards forpackagingthermalmanagementathomeand abroad. It is of great engineering guiding significance for understanding the developmentoftechnology and standardization.
Keywords： ceramic; packaging; thermal management; standards
0 引言
集成電路芯片演進(jìn)的核心基石與標(biāo)志是摩爾定律。（剩余4545字）