低放熱型可回收的聚酰亞胺-環(huán)氧Vitrimer材料的制備與性能

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關(guān)鍵詞：環(huán)氧Vitrimer雙馬來酰亞胺二硫鍵低放熱型樹脂熱壓回收中圖分類號：TB332；TQ323.5 文獻(xiàn)標(biāo)志碼：A 文章編號：1671-8755（2025）02-0001-06

Preparation and Properties of Low-exotherm Recyclable Polyimide -Epoxy Vitrimer Materials

YAN Ruiyong'，2， ZHOU Lin12，LUO Shikai2，CHEN Mao2 （1. State Key Laboratory of Environment-friendly Energy Materials， Southwest University of Science and Technology，Mianyang 62101O， Sichuan， China；2. Institute of Chemical Materials， China Academy of Engineering Physics，Mianyang 6219oo， Sichuan，China）

Abstract：To develop a novel recyclable thermoseting resin with low exothermicity，a polyimide- epoxy vitrimer material （PI -Er）was prepared using 4 -aminophenyl disulfide （AFD）as the curing agent， diglycidyl ether bisphenol A（DGEBA）and 4，4-bismaleimide diphenylmethane （BMI） as raw materials in a 1：1：1 molar ratio by Michael addition and epoxy ring-opening reactions. And the structure and properties of the material were characterized.The results show that the PI-Er material exhibits a glass transition temperature Tg of 156 C and a thermal decomposition temperature Td of 351 C . The material demonstrates dynamic behavior at elevated temperatures，with a rearrangement temperature Tv of 172 C ， enabling thermal compression recycling at 200°C . Compared to disulfide-containing DA resin， PI-Er （20 has a higher initial exothermic temperature，while exhibiting a lower heat release rate than non-disulfide DM resin. The disulfide bonds in PI-Er facilitate material recycling and lower heat release rate，while the presence of BMI improves the thermal stability of the material and allows it to release heat at higher temperatures，achieving the purpose of preparing low heat release recyclable thermosetting resin.

Keywords：Epoxy vitrimer；Bismaleimide；Low-exothermic resin with disulfide bond； Thermal compression recycling

熱固性樹脂在許多領(lǐng)域發(fā)揮著關(guān)鍵作用，不同的熱固性樹脂可應(yīng)用于多種不同的場景。（剩余7083字）