活性添加劑分散調(diào)控對(duì) 鍍銅線精細(xì)化的影響
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中圖分類號(hào)：TQ153.14 文獻(xiàn)標(biāo)志碼：A 文章編號(hào)： 1000-5013（2025）04-0379-07
Influence of Dispersion Control of Active Additives on Refinement of Copper Plated Wire
LE Qihe， JIANG Kaiyong
（Fujian Key Laboratory of Special Energy Manufacturing，Huaqiao University，Xiamen 36lO21，China）
Abstract：To address the issue of edge refinement of copper plated wires in flexible cathode electrochemical machining，the influence of additive particle size and dispersion on copper plating quality was studied. The grinding time of additive particles and the slurry stirring method were adjusted，and laser activation was combined with electroless copper plating processes to prepare conductive wires and their morphology was analyzed. The results demonstrated that grinding time significantly influenced the particle size，which stabilized at 1.445 （20 μm after 48 hours of grinding，with improved dispersibility and reduced agglomeration. After stirring for 5mi 二 nutes using a high-speed disperser，the particle area fraction in polyurethane decreased by 11.9% compared to traditional stirring.The refinement and uniformly dispersed additive particles improved the uniformityof laser activated catalytic centers.Under the optimal conditions （48 hours grinding and 5 minutes high-speed stirring），the copper plated wires exhibited sharp and wel-defined edges，uniform distribution，and aconsistent wire width of approximately 85.1μm
Keywords：electrochemical machining;；laser activation； electroless plating copper;refinement；particle dispersibility
柔性陰極電解加工（FC-ECM）作為一種融合激光誘導(dǎo)化學(xué)鍍（LDS）的創(chuàng)新性微納制造工藝，近年來在柔性電子器件、三維模塑互連器件（3D-MID）及高精度傳感器等領(lǐng)域展現(xiàn)出廣闊的應(yīng)用前景[1-4]。（剩余8908字）